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- SiC Wafers for Power Semiconductors
SiC Wafers for Power Semiconductors
DESCRIPTION
We undertake SiC power semiconductor wafer production processes with Hi-LoDe LapTM, which harnesses our ceramic material polishing technologies accumulated over the years, and Hi-LoDe EpiTM, which is aimed at reducing defects.
Features:
Our SiC epitaxial wafer has the following features.
- High flatness achieved by high-precision polishing technology
- Minimizing hidden scratches of SiC wafer by unique CMP
- Contributes to improving the productivity of SiC devices
Proterial Asia