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- Si3N4 Insulating Substrates for Power Semiconductor Modules
Si3N4 Insulating Substrates for Power Semiconductor Modules
DESCRIPTION
Proprietary Features
We have succeeded in developing materials of both improved strength and heat conductivity, attributes which usually involve a trade-off. At 130W/m・k, we have achieved the world’s highest standard.
Associated Benefits
Fields of Applications:
- Can be widely used as a structural material where thermal shock resistance and heat-resistant fatigue are required.
- Its high degree of purity makes it suitable for use as a semiconductor manufacturing device material.
Applications
- Insulation boards for Peltier elemental modules
- Semiconductor manufacturing equipment material
- Heat-resistant structural material
Proterial Asia