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Clad Metals

DESCRIPTION

Developed according to our proprietary technology, these clad metals feature low thermal expansion and high thermal conductivity. They are best-suited for heat-dissipating substrates of power semiconductor modules and lead wires for power semiconductors.

Products:

The novel metal materials that we develop underlie progress in the world of electronics and define next-generation standards that will remain in place long into the future.

Technologies:

We seek to acquire exhaustive knowledge of the relative advantages of different metals, and to develop technologies for extracting those advantages. By combining the strengths of various metals, we create novel metal materials with superior properties.

REVENUES
1000 B
OVERSEAS SALES RATIO
0 %
EMPLOYEES
26300

LEADING SUSTAINABILITY BY HIGH PERFORMANCE