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Clad Metals
DESCRIPTION
Developed according to our proprietary technology, these clad metals feature low thermal expansion and high thermal conductivity. They are best-suited for heat-dissipating substrates of power semiconductor modules and lead wires for power semiconductors.
Products:
The novel metal materials that we develop underlie progress in the world of electronics and define next-generation standards that will remain in place long into the future.
Technologies:
We seek to acquire exhaustive knowledge of the relative advantages of different metals, and to develop technologies for extracting those advantages. By combining the strengths of various metals, we create novel metal materials with superior properties.
Proterial Asia